High Performance Integrated Circuit Design
- Chip Optimization
Second Sourcing - Power reduction, speed enhancement, returning to new process Reverse Engineering
- IC Designs - ROMS, DRAMS/SRAMS, Compiler/ASIC, Macros, Analogue
Full CAD Facility In-House - HSPICE, Schematic Capture, Layout Extraction, Layout Editor, DRC, LVS, SPR
- Topological Reviews
- Radiation Analysis and Design - SEU, Transient, Total Dose
Multi-Chip System Interfacing
- Memory Performance - Speed, Timing, Power
- Memory/System Compatibility
- Memory Radiation Performance
Electrical Process Characterization
- Technologies - Unipolar MOSFETS, BulkCMOS, SOS/SOI
- Radiation Specification and Testing
- Spice Parametric Extraction
- Electrical Specification of New Processes
- Design Rule Evaluation - Critique, Develop, Optimize
- Test Chip Generation
- Consulting Engineer to Legal Profession
- Expert witness in more than 30 patent litigations.
Advanced VLSI Design Group; Advanced Technology Labs of RCA/GE, Moorestown, NJ, Staff Engineer
- Design and project responsibility 3-25ns CMOS SOS Radiation Hardened SRAMS
- Generated CMOS SOS design rules (1.2) and process specification.
- Modeled processes for "SPICE like" circuit simulation program.
- Directed test chip generation and evaluation for Rad-Hard Process.
- Advanced Memory Products, Solid State Scientific, Willow Grove, PA. Senior
- Design and project responsibility for CMOS memory product line which included 13 IC's. Among those were a sub 100ns 256K CMOS ROM and 35ns 16K CMOS SRAM with 4 column redundancy.
- Proposed and electrically specified the first 5v N-well double poly CMOS process.
- Specified and designed process evaluation test chips and electrically modeled characteristics of the then State-Of-The-Art processes.
- Initiated, enhanced, and supported MSINC (similar to SPICE) circuit simulation program.
- Memory Products; M.O. S. Technology, Valley Forge, PA, Senior Engineer
- Wrote CAD analysis program (ICCA) and characterized the P-channel and N-channel processes for same.
- Design and project responsibility for five memory chip designs including 3 DRAMS.
- Advanced Development Group; General Instrument Corp., Hicksville, L.I., NY,
- Worked on design team of the first 256-bit DRAM
- Solid State Device Dept; Bayside Research Labs of General Telephone and Electronics, NY, Engineer
- Designed and developed circuits and subsystems suitable for integration.
- Designs included MOS Multiplier and D/A converter.
Honors & Publications
- 6 Granted patents, 12 Pending or applied for
- M.S., Electrical Engineering, Clarkson University, 1964, Computer System Design
- B.S., Electrical Engineering, Clarkson University, 1963, Computer Logic Design
- Post graduate work, New York University, Drexel University