Optoelectronics Physicist Consultant

Optoelectronics Physicist Consultant (566)

Present: Services in technology intelligence, analysis and management and in technology transfer. Expertise in electronic and opto electronic materials, devices, packaging and subsystems. Management services at project and program levels.

GTE LABORATORIES INCORPORATED Initially as Principal Investigator, then as Department Manager (1/82), responsible for components for high speed communications systems. Developed wide capability in compound semiconductor materials, devices and packaging for both electronic and optoelectronic applications. Group size: 25-30. Responsible for a budget approximately $3 million.

As Technology Center Director, responsible for all electronic component development in GTE, in both Si and GaAs. Projects included silicon-on-insulator, submicron technology, VLSI (Si) design, VLSI fabrication and VLSI testing, Si power electronics, III-V heterojunction technology, high speed GaAs digital integrated circuits and packaging. Program director of major externally funded, inter organizational program for development of massively parallel computer interconnections. Group size: 75. Responsibility budget approximately $10 million.

As Technical Program Director, staff position with responsibility for originating, integrating and managing technical programs spanning multiple organizations with GTE Laboratories and between GTE and external organizations. Pioneered current program in hybrid wafer scale integration for electronic and optoelectronic systems. Introduced and directed major MCM program initiative for digital signal processing in Government Systems Division. Initiator and director of projection wireless LAN and IVHS using free space optical communications. Group size and budget matrixed.

EXXON, OPTICAL INFORMATION SYSTEMS First employee and chief technologist in start-up venture. Designed total physical opto electronic facility for processing, testing, and packaging of optoelectronic devices. Worked directly with contractors in all phases of construction. Hired key technical staff. Responsible for transferring opto electronics R&D process to manufacturing environment

RCA LABORATORIES Member of Technical Staff. Responsible for developing a wide range of materials and device technologies related to electronics, optoelectronic and optics, including lasers, LEDs, photo cathodes, crystal growth, contact metallurgy, holographic analysis, spectrometry, electronic testing, etc. Directly responsible for transfer of technology to product division. Received David Sarnoff Outstanding Achievement Award for contributions to materials and device technology.

NEW YORK UNIVERSITY Research Associate/Graduate Student. Research on microwave for electronics & opto electronic spin photon interactions at low temperatures. Dissertation on acoustic paramagnetic resonance in semiconductors.

SYLVANIA RESEARCH LABORATORY Staff Physicist. Responsible for developing semiconductor processing, materials and devices. Landmark paper on high efficiency junction luminescence led to subsequent development of semiconductor laser.

RECENT PROFESSIONAL ACTIVITIES

Fellow, Institute of Electrical and Electronics Engineers; Member, American Physical Society
Conference Chairman: IEEE Topical Conference on Hybrid Optoelectronic Integration and Packaging (1993)
Conference Chairman: IEEE Symposium on. Computer and Communication Systems (1991)
Optoelectronic Industries Development Association (OIDA), board member (as GTE representative
High Density Packaging User Group, founding member
Industrial Advisory Boards: U. Colorado, Columbia U., U. Illinois, Northeastern U., U. New Mexico

RECENT INVITED PRESENTATIONS AT INTERNATIONAL SYMPOSIA

"A Low-Cost Hermetic Multifiber Array Packaging Technology," ISHM/IEPS Adv. Technology Workshop, 20 February 1995
"Optoelectronic Packaging for Communications and Computer Systems," MRS Conference, Boston, 29 November 1993.
"Optical Interconnections on Si Waferboard, A Platform for High Density Integration," OFC '92, San Jose, 5 February 1992
"Hybrid Wafer Scale Optoelectronic Integration," Int'l Symposium on Advances in Packaging and Interconnects (OPTCON), Boston, 8 November 1990.
"Optoelectronic Integration in the Distribution Network," IEEE Symposium on Interconnections within High Speed Digital Systems, Santa Fe, 15 May 1990.

PATENTS & PUBLICATIONS